Silicone bonded with hardware
Silicone bonded with hardware
| Silicone Package Hardware & Ceramics The silicone encapsulation hardware process is a common processing technology. Great mainly has liquid silicone encapsulation injection molding process and solid silicone encapsulation process. Liquid silicone overmolding injection molding processes are generally more precise. First, the hardware parts that need to be encapsulated are placed into the mold, then liquid silicone is injected into the parts at an appropriate temperature, and the mold is used to heat and solidify the silicone. This process can achieve more beautiful product bonding details and better fit and is suitable for manufacturing some relatively precise rubber-coated products, such as smart wearables, e-books, medical rubber-coated products, etc. Compared with the liquid silicone encapsulation process, the solid silicone encapsulation process has different encapsulation effects. The solid silicone encapsulation process is more suitable for products with weaker hardware dislocation and offset requirements. In the case of the same cavity, because the mold processing and manufacturing cost is relatively low, it is more widely used in the market, such as cake pans, screw caps, etc. In general, the silicone package hardware process can improve the quality and aesthetics of the product and is widely used in various fields. With the advancement of science and technology and the diversified demands, Great’s silicone-coated magnets, PC boards, and ceramic technologies are also becoming better and better. |
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ShenZhen Great Technoloy Co., Ltd. was founded in 2005, specializing in the research and development, production and sales of silicone and rubber products.-20150609
